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Effects of Post-annealing and Co Interlayer Between SiNx and Cu on the Interfacial Adhesion Energy for Advanced Cu Interconnections

Lee, Hyeonchul; Jeong, Minsu; Kim, Gahui; Son, Kirak; Seo, Jeongmin; Kim, Taek-Soo; Park, Young-Bae, ELECTRONIC MATERIALS LETTERS, v.16, no.4, pp.311 - 320, 2020-07

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