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Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 |
Electron microscopy of high pressure crystallised poly (p-phenylene sulfide) Lu, J; Oh, Il-Kwon; Huang, R; Cheng, TH; Wang, XL, PLASTICS RUBBER AND COMPOSITES, v.37, no.5-6, pp.263 - 267, 2008 |
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