Browse "ME-Journal Papers(저널논문)" by Author Yoo, Choong D.
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| Effect of Process Parameters on TSV Formation Using Deep Reactive Ion Etching Kim, Kwang-Seok; Lee, Young-Chul; Ahn, Jee-Hyuk; Song, Jun Yeob; Yoo, Choong D.; Jung, Seung-Boo, KOREAN JOURNAL OF METALS AND MATERIALS, v.48, no.11, pp.1028 - 1034, 2010-11 |
| Thermosonic soldering of cross-aligned strip solder bumps for easy alignment and low-temperature bonding Lee, Jihye; Yoo, Choong D., JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.18, no.12, 2008 |
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