Showing results 1 to 3 of 3
COP: a new corner detector Bae, SC; Kweon, In-So; Yoo, CD, PATTERN RECOGNITION LETTERS, v.23, no.11, pp.1349 - 1360, 2002-09 |
Influence of pad shape on self-alignment in electronic packaging Ahn, DH; Lee, J; Yoo, CD; Kim, YS, JOURNAL OF ELECTRONIC MATERIALS, v.35, no.3, pp.411 - 415, 2006-03 |
Thermosonic bonding of crossed strip Au bumps Kim, JH; Kim, BC; Lee, J; Yoo, CD, SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, v.10, no.5, pp.604 - 609, 2005 |
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