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Browse "ME-Journal Papers(저널논문)" by Author Shin, DK

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Showing results 1 to 4 of 4

1	A study on the impact failure mechanism of aluminum-PMMA interfacial crack Shin, DK; Lee, Jungju; Lyu, MY, FRACTURE AND STRENGTH OF SOLIDS, PTS 1 AND 2 BOOK SERIES: KEY ENGINEERING MATERIALS, v.183-1, pp.259 - 264, 2000
2	Effective material properties and thermal stress analysis of epoxy molding compound in electronic packaging Shin, DK; Lee, Jungju, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, v.21, no.4, pp.413 - 421, 1998-11
3	Fracture parameters of interfacial crack of bimaterial under the impact loading Shin, DK; Lee, Jungju, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.38, no.30-31, pp.5303 - 5322, 2001-08
4	Numerical analysis of dynamic T stress of moving interfacial crack Shin, DK; Lee, Jungju, INTERNATIONAL JOURNAL OF FRACTURE, v.119, no.3, pp.223 - 245, 2003-02

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