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Browse "ME-Journal Papers(저널논문)" by Author Park, TS

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Showing results 1 to 10 of 10

1	A comparative study of the fatigue Behavior of SnAgCu and SnPb solder joints Kim, IH; Park, TS; Yang, SY; Lee, Soon-Bok, ADVANCES IN FRACTURE AND STRENGTH, PTS 1- 4, v.297-300, pp.831 - 836, 2005
2	An experimental technique for the strain measurement of small structures using pattern recognition Park, TS; Baek, DC; Lee, Soon-Bok, SENSORS AND ACTUATORS A-PHYSICAL, v.115, no.1, pp.15 - 22, 2004-09
3	Application of a near-wall turbulence model to the flows over a step with inclined wall Ahn, JW; Park, TS; Sung, Hyung Jin, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.18, no.2, pp.209 - 217, 1997-04
4	Development of a near-wall turbulence model and application to jet impingement heat transfer Park, TS; Sung, Hyung Jin, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.22, no.1, pp.10 - 18, 2001-02
5	Development of a nonlinear near-wall turbulence model for turbulent flow and heat transfer Park, TS; Sung, Hyung Jin; Suzuki K, INTERNATIONAL JOURNAL OF HEAT AND FLUID FLOW, v.24, no.1, pp.29 - 40, 2003-02
6	Experimental techniques for fatigue reliability of BGA solder bumps in electronic packaging Lee, Soon-Bok; Park, TS; Ham, SJ, JSME INTERNATIONAL JOURNAL SERIES A-SOLID MECHANICS AND MATERIAL ENGINEERING, v.43, no.4, pp.400 - 407, 2000-10
7	Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03
8	Local convective mass transfer on circular cylinder with transverse annular fins in crossflow Sung, Hyung Jin; Yang, JS; Park, TS, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.39, pp.1093 - 1101, 1996
9	Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, no.3, pp.237 - 244, 2005-09
10	Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04

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