Browse "ME-Journal Papers(저널논문)" by Author Park, Jin-Hyoung
Showing results 1 to 5 of 5
| A Study of Hygrothermal Behavior of ACF Flip Chip Packages With Moire Interferometry Park, Jin-Hyoung; Jang, Kyung-Woon; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.33, no.1, pp.215 - 221, 2010-03 |
| A study on thermal cycling (T/C) reliability of anisotropic conductive film (ACF) flip chip assembly for thin chip-on-board (COB) packages Jang, Kyung-Woon; Park, Jin-Hyoung; Lee, Soon-Bok; Paik, Kyung-Wook, MICROELECTRONICS RELIABILITY, v.52, no.6, pp.1174 - 1181, 2012-06 |
| In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moire Method With a Pseudo-Phase-Shifting Technique Jang, Jae-Won; Park, Jin-Hyoung; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.1992 - 2000, 2012-12 |
| Structure-dependent mechanical behavior of copper thin films Lee, Yong Seok; Ha, Sangyul; Park, Jin-Hyoung; Lee, Soon-Bok, MATERIALS CHARACTERIZATION, v.128, pp.68 - 74, 2017-06 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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