Browse "ME-Journal Papers(저널논문)" by Author Nam, Dong Jin

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Fabrication of a flip chip solder bump using a thin mold and ultrasonic filling

Nam, Dong Jin; Lee, Jae Hak; Lee, Jihye; Yoo, Choong Don, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.17, no.9, pp.1863 - 1869, 2007-09

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