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Quantification of Performance Variation and Crack Evolution of Bond-Wire Interconnects Under Harsh Temperature Environments by S-Parameter Analysis

Kang, Tae Yeob; Seo, Donghwan; Min, Joonki; Kim, Taek-Soo, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.11, no.6, pp.990 - 998, 2021-06

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