Browse "ME-Journal Papers(저널논문)" by Author Li, Mingyu
Showing results 1 to 2 of 2
| Effects of Ag addition on solid-state interfacial reactions between Sn-Ag-Cu solder and Cu substrate Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Li, Mingyu, MATERIALS CHARACTERIZATION, v.124, pp.250 - 259, 2017-02 |
| Growth inhibition of interfacial intermetallic compounds by pre-coating oriented Cu6Sn5 grains on Cu substrates Yang, Ming; Ko, Yong Ho; Bang, Junghwan; Kim, Taek-Soo; Lee, Chang-Woo; Zhang, Shuye; Li, Mingyu, JOURNAL OF ALLOYS AND COMPOUNDS, v.701, pp.533 - 541, 2017-04 |
Discover
Type
- 12,135 Article
Open Access
- 406 OA Article
Date issued
- 1,577 2020 - 2024
- 3,947 2010 - 2019
- 3,679 2000 - 2009
- 2,269 1990 - 1999
- 600 1980 - 1989