Browse "ME-Journal Papers(저널논문)" by Author Kim, Hak Sung
Showing results 1 to 2 of 2
| Avoidance of fabricational thermal residual stresses in co-cure bonded metal-composite hybrid structures Kim, Hak Sung; Lee, Dai Gil, JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, v.20, no.9, pp.959 - 979, 2006 |
| Smart cure cycle with cooling and reheating for co-cure bonded steel/carbon epoxy composite hybrid structures for reducing thermal residual stress Kim, Hak Sung; Park, Sang Wook; Lee, Dai Gil, COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, v.37, no.10, pp.1708 - 1721, 2006 |
Discover
Type
- 12,200 Article
Open Access
- 407 OA Article
Date issued
- 1,618 2020 - 2024
- 3,971 2010 - 2019
- 3,679 2000 - 2009
- 2,269 1990 - 1999
- 600 1980 - 1989