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Browse "ME-Journal Papers(저널논문)" by Author Kim, Cheolgyu

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Showing results 1 to 18 of 18

1	A high aspect ratio serpentine structure for use as a strain-insensitive, stretchable transparent conductor Jang, Sungwoo; Kim, Cheolgyu; Park, Jung Jin; Jin, Ming Liang; Kim, Seon Joon; Park, O Ok; Kim, Taek-Soo; et al, SMALL, v.14, no.8, 2018-02
2	A quantitative strain analysis of a flexible single-crystalline silicon membrane Bong, Jae Hoon; Kim, Cheolgyu; Hwang, Wan Sik; Kim, Taek-Soo; Cho, Byung Jin, APPLIED PHYSICS LETTERS, v.110, no.3, 2017-01
3	Control of Reversible Self-Bending Behavior in Responsive Janus Microstrips OH, Myung Seok; Song, Young Shin; Kim, Cheolgyu; Kim, Jongmin; You, Jae Bem; Kim, Taek-Soo; Lee, Chang-Soo; et al, ACS APPLIED MATERIALS & INTERFACES, v.8, no.13, pp.8782 - 8788, 2016-04
4	Design of ultrathin OLEDs having oxide -based transparent electrodes and encapsulation with sub -mm bending radius Kim, Eungjun; Kwon, Jeonghyun; Kim, Cheolgyu; Kim, Taek-Soo; Choi, Kyung Cheol; Yoo, Seunghyup, ORGANIC ELECTRONICS, v.82, 2020-07
5	Desolvation-Triggered Versatile Transfer-Printing of Pure BN Films with Thermal-Optical Dual Functionality Han, Yujin; Han, Hyeuk Jin; Rah, Yoonhyuk; Kim, Cheolgyu; Kim, Moohyum; Lim, Hunhee; Ahn, Kwang Ho; et al, ADVANCED MATERIALS, v.32, no.38, pp.2002099, 2020-09
6	Direct Graphene Transfer and Its Application to Transfer Printing Using Mechanically Controlled, Large Area Graphene/Copper Freestanding Layer Seo, Jeongmin; Kim, Cheolgyu; Ma, Boo Soo; Lee, Tae-Ik; Bong, Jae Hoon; Oh, Joong Gun; Cho, Byung-Jin; et al, ADVANCED FUNCTIONAL MATERIALS, v.28, no.26, 2018-04
7	Effect of anisotropic thermo-elastic properties of woven-fabric laminates on diagonal warpage of thin package substrates Lee, Tae-Ik; Kim, Cheolgyu; Pyo, Jae-Bum; Kim, Min Sung; Kim, Taek-Soo, COMPOSITE STRUCTURES, v.176, pp.973 - 981, 2017-09
8	Flash-Induced Stretchable Cu Conductor via Multiscale-Interfacial Couplings Park, Jung Hwan; Seo, Jeongmin; Kim, Cheolgyu; Joe, Daniel Juhyung; Lee, Han Eol; Im, Tae Hong; Seok, Jae Young; et al, ADVANCED SCIENCE, v.5, no.11, pp.1801146, 2018-10
9	Flexural and tensile moduli of flexible FR4 substrates Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, POLYMER TESTING, v.53, pp.70 - 76, 2016-08
10	Human-Palm-Inspired Artificial Skin Material Enhances Operational Functionality of Hand Manipulation Heo, Si-Hwan; Kim, Cheolgyu; Kim, Taek-Soo; Park, Hyung-Soon, ADVANCED FUNCTIONAL MATERIALS, v.30, no.25, pp.2002360, 2020-05
11	Mechanical and Electrical Reliability Analysis of Flexible Si Complementary Metal-Oxide-Semiconductor Integrated Circuit Kim, Seungyoon; Kim, Cheolgyu; Bong, Jae Hoon; Hwang, Wan Sik; Kim, Taek-Soo; Oh, Jae Sub; Cho, Byung Jin, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.19, no.10, pp.6473 - 6480, 2019-10
12	Mechanical Stability Analysis via Neutral Mechanical Plane for High-Performance Flexible Si Nanomembrane FDSOI Device Kim, Seung-Yoon; Bong, Jae Hoon; Kim, Cheolgyu; Hwang, Wan Sik; Kim, Taek-Soo; Cho, Byung Jin, ADVANCED MATERIALS INTERFACES, v.4, no.21, 2017-11
13	Mechanism of warpage orientation rotation due to viscoelastic polymer substrates during thermal processing Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, MICROELECTRONICS RELIABILITY, v.73, pp.136 - 145, 2017-06
14	Nanotransplantation Printing of Crystallographic-Orientation-Controlled Single-Crystalline Nanowire Arrays on Diverse Surfaces Han, Hyeuk Jin; Jeong, Jae Won; Yang, Se Ryeun; Kim, Cheolgyu; Yoo, Hyeon Gyun; Yoon, Jun-Bo; Park, Jaehong; et al, ACS NANO, v.11, no.11, pp.11642 - 11652, 2017-11
15	Prediction of time-dependent swelling of flexible polymer substrates using hygro-mechanical finite element simulations Pyo, Jae-Bum; Lee, Tae-Ik; Kim, Cheolgyu; Kim, Min Sung; Kim, Taek-Soo, SOFT MATTER, v.12, no.18, pp.4135 - 4141, 2016-03
16	Reversible self-bending soft hydrogel microstructures with mechanically optimized designs Kim, Jongmin; Kim, Cheolgyu; Song, YoungShin; Jeong, Seong-Geun; Kim, Taek-Soo; Lee, Chang-Soo, CHEMICAL ENGINEERING JOURNAL, v.321, pp.384 - 393, 2017-08
17	Warpage Analysis of Electroplated Cu Films on Fiber-Reinforced Polymer Packaging Substrates Kim, Cheolgyu; Lee, Tae-Ik; Kim, Min Sung; Kim, Taek-Soo, POLYMERS, v.7, no.6, pp.985 - 1004, 2015-06
18	Wireless powered wearable micro light-emitting diodes Lee, Haneol; Lee, Daewon; Lee, Tae-Ik; Shin, Jung Ho; Choi, Gwang-Mun; Kim, Cheolgyu; Lee, Seung Hyung; et al, NANO ENERGY, v.55, pp.454 - 462, 2019-01

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