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Browse "ME-Journal Papers(저널논문)" by Author Jang, Jae-Won

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Showing results 1 to 8 of 8

1	A graphene meta-interface for enhancing the stretchability of brittle oxide layers Won, Sejeong; Jang, Jae-Won; Choi, Hyung-Jin; Kim, Chang-Hyun; Lee, Sang Bong; Hwangbo, Yun; Kim, Kwang-Seop; et al, NANOSCALE, v.8, no.9, pp.4961 - 4968, 2016
2	Analysis of a complete contact problem in bonded condition: Comparison of experimental-numerical analyses and theoretical solutions Kim, Hyung-Kyu; Jang, Jae-Won; Lee, Soon-Bok, TRANSACTIONS OF THE KOREAN SOCIETY OF MECHANICAL ENGINEERS A, v.39, no.6, pp.583 - 588, 2015-06
3	In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moire Method With a Pseudo-Phase-Shifting Technique Jang, Jae-Won; Park, Jin-Hyoung; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.1992 - 2000, 2012-12
4	Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes Hwangbo, Yun; Lee, Choong-Kwang; Mag-Isa, Alexander E.; Jang, Jae-Won; Lee, Hak-Joo; Lee, Soon-Bok; Kim, Seong Su; et al, CARBON, v.77, pp.454 - 461, 2014-10
5	Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05
6	Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis Jang, Jae-Won; Kim, Hyung-Kyu; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.82, pp.39 - 46, 2016-03
7	Statistical Characteristics of Fatigue Failure of Copper Thin Films Jang, Jae-Won; Hwangbo, Yun; Kim, Jae-Hyun; Lee, Hak-Joo; Mag-isa, Alexander E.; Lee, Soon-Bok, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4, 2013-10
8	Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07

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