Browse "ME-Journal Papers(저널논문)" by Author Chun, Jung-Hoon
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Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, v.3, no.5, pp.P169 - P178, 2014-04 |
| Scratching of Patterned Cu/Dielectric Surface Layers by Pad Asperities in CMP Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.28, no.1, pp.96 - 105, 2015-02 |
| The Effect of Pad-asperity Curvature on Material Removal Rate in Chemical-mechanical Polishing Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, Procedia CIRP, v.14, pp.42 - 47, 2014 |
| The Role of Pad Topography in Chemical-Mechanical Polishing Kim, Sanha; Saka, Nannaji; Chun, Jung-Hoon, IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, v.27, no.3, pp.431 - 442, 2014-08 |
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