Showing results 6 to 8 of 8
Moisture induced interface weakening in ACF package Sim, Gidong; Chung, Chang-Kyu; Paik, Kyung-Wook; Lee, Soon-Bok, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.528, no.2, pp.698 - 705, 2010-12 |
Tensile and fatigue behaviors of printed Ag thin films on flexible substrates Sim, Gidong; Won, Sejeong; Lee, Soon-Bok, APPLIED PHYSICS LETTERS, v.101, no.19, 2012-11 |
Tensile characteristics of metal nanoparticle films on flexible polymer substrates for printed electronics applications Kim, Sang Hyeok; Won, Sejeong; Sim, Gidong; Park, In-Kyu; Lee, Soon-Bok, NANOTECHNOLOGY, v.24, no.8, 2013-03 |
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