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Browse "ME-Journal Papers(저널논문)" by Subject TECHNOLOGY

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Showing results 23 to 30 of 30

23	Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05
24	Multi-objective optimization of VOC recovery and reuse in crude oil loading Lee, Sangick; Choi, Inhwan; Chang, Daejun, APPLIED ENERGY, v.108, pp.439 - 447, 2013-08
25	Polarization Resistances of (Ln(1-x)Sr(x))CoO3 (Ln=Pr, Nd, Sm, and Gd x=0, 0.3, 0.5, 0.7, and 1) as Cathode Materials for Intermediate Temperature-operating Solid Oxide Fuel Cells Kim, Jung Hyun; Baek, Seung-Wook; Bae, Joongmyeon, JOURNAL OF FUEL CELL SCIENCE AND TECHNOLOGY, v.6, no.3, 2009-08
26	Recent Advances in Ocean Nuclear Power Plants Lee, Kang-Heon; Kim, Min-Gil; Lee, Jeong-Ik; Lee, Phill-Seung, ENERGIES, v.8, no.10, pp.11470 - 11492, 2015-10
27	Start-up strategy of a diesel reformer using the decomposition heat of hydrogen peroxide for subsea applications Han, Gwangwoo; Bae, Minseok; Cho, Sungbaek; Bae, Joongmyeon, JOURNAL OF POWER SOURCES, v.448, 2020-02
28	Thermal stability characteristics of high-power, large-capacity, reserve thermal batteries with pure Li and Li(Si) anodes Cho, Jang-Hyeon; Im, Chae Nam; Choi, Chi Hun; Ha, Sang-hyeon; Yoon, Hyun-Ki; Choi, Yusong; Bae, Joongmyeon, ELECTROCHIMICA ACTA, v.353, 2020-09
29	Thermosonic bonding of lead-free solder with metal bump for flip-chip bonding Lee, JY; Kim, JH; Yoo, Choong-Don, JOURNAL OF ELECTRONIC MATERIALS, v.34, no.1, pp.96 - 102, 2005-01
30	Using lateral vibration for thermosonic flip-chip interconnection with anisotropic conductive film Kim, Kyung-Soo; Ha, CW; Jang, TY; Joung, SW; Yun, WS, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, v.20, no.10, 2010-10

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