Showing results 4 to 6 of 6
Reducing Bonding Temperature and Energy Consumption in Electronic Packaging Using Flash Electro-Thermal Carbon Fiber Heating Elements Park, Seong Yeon; On, Seung Yoon; Kim, Junmo; Lee, Jeonyoon; Kim, Taek-Soo; Wardle, Brian L.; Kim, Seong Su, ACS APPLIED MATERIALS & INTERFACES, v.15, no.32, pp.38750 - 38758, 2023-08 |
Residual stress-driven test technique for freestanding ultrathin films: Elastic behavior and residual strain Cuddalorepatta, Gayatri K.; Sim, Gi-Dong; Li, Han; Pantuso, Daniel; Vlassak, Joost J., JOURNAL OF MATERIALS RESEARCH, v.34, no.20, pp.3474 - 3482, 2019-10 |
Segmentation of measured point data using a parametric quadric surface approximation Yang, Min-Yang; Lee, E, COMPUTER-AIDED DESIGN, v.31, no.7, pp.449 - 457, 1999-06 |
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