Showing results 7 to 10 of 10
Fatigue and fracture assessment for reliability in electronics packaging Lee, Soon-Bok; Kim, I; Park, TS, INTERNATIONAL JOURNAL OF FRACTURE, v.150, pp.91 - 104, 2008-03 |
Local convective mass transfer on circular cylinder with transverse annular fins in crossflow Sung, Hyung Jin; Yang, JS; Park, TS, INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, v.39, pp.1093 - 1101, 1996 |
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC PACKAGING, v.127, no.3, pp.237 - 244, 2005-09 |
Low-cycle fatigue characteristics of Sn-based solder joints Lee, KO; Yu, Jin; Park, TS; Lee, Soon-Bok, JOURNAL OF ELECTRONIC MATERIALS, v.33, no.4, pp.249 - 257, 2004-04 |
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