Browse "ME-Journal Papers(저널논문)" by Author Jang, Jae-Won
Showing results 3 to 8 of 8
| In-Plane Deformation Measurement of Thin Packages Using an Atomic Force Microscope Moire Method With a Pseudo-Phase-Shifting Technique Jang, Jae-Won; Park, Jin-Hyoung; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.12, pp.1992 - 2000, 2012-12 |
| Interlayer non-coupled optical properties for determining the number of layers in arbitrarily stacked multilayer graphenes Hwangbo, Yun; Lee, Choong-Kwang; Mag-Isa, Alexander E.; Jang, Jae-Won; Lee, Hak-Joo; Lee, Soon-Bok; Kim, Seong Su; et al, CARBON, v.77, pp.454 - 461, 2014-10 |
| Measurement and Analysis for Residual Warpage of Chip-on-Flex (COF) and Chip-in-Flex (CIF) Packages Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.5, pp.834 - 840, 2012-05 |
| Numerical and experimental investigation of a complete contact problem by comparing with an asymptotic analysis Jang, Jae-Won; Kim, Hyung-Kyu; Lee, Soon-Bok, INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, v.82, pp.39 - 46, 2016-03 |
| Statistical Characteristics of Fatigue Failure of Copper Thin Films Jang, Jae-Won; Hwangbo, Yun; Kim, Jae-Hyun; Lee, Hak-Joo; Mag-isa, Alexander E.; Lee, Soon-Bok, JOURNAL OF ENGINEERING MATERIALS AND TECHNOLOGY-TRANSACTIONS OF THE ASME, v.135, no.4, 2013-10 |
| Warpage Behavior and Life Prediction of a Chip-on-Flex Package Under a Thermal Cycling Condition Jang, Jae-Won; Suk, Kyoung-Lim; Park, Jin-Hyoung; Paik, Kyung-Wook; Lee, Soon-Bok, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.7, pp.1144 - 1151, 2014-07 |
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