Acoustic Emission during thermal cycling of Cu-Al-Mn alloys
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | J. O. Lee | ko |
| dc.contributor.author | Kim, Ho Chul | ko |
| dc.date.accessioned | 2013-02-25T13:18:08Z | - |
| dc.date.available | 2013-02-25T13:18:08Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1990 | - |
| dc.identifier.citation | JOURNAL OF MATERIALS SCIENCE LETTERS, v.9 | - |
| dc.identifier.issn | 0261-8028 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/62454 | - |
| dc.language | English | - |
| dc.publisher | Springer | - |
| dc.title | Acoustic Emission during thermal cycling of Cu-Al-Mn alloys | - |
| dc.type | Article | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 9 | - |
| dc.citation.publicationname | JOURNAL OF MATERIALS SCIENCE LETTERS | - |
| dc.contributor.nonIdAuthor | J. O. Lee | - |
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