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Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2161 - 2167, IEEE-CPMT, 2017-06-01

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