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Showing results 1 to 4 of 4

1
Chemical-Mechanical Polishing of a Soft Pad Asperity with Protective Hard Thin Film

Ryu, Hyun Jun; Kim, Dong Geun; Kang, Sukkyung; Jeong, Ji-hun; Kim, Sanha, International Symposium on Precision Engineering and Sustainable Manufacturing (PRESM2020), Korean Society for Precision Engineering (KSPE), 2020-11-15

2
Evaluation of Polishing Performance by CMP Pad with Bi-layered Asperities

Ryu, Hyun Jun; Kim, Sanha; Jeong, Ji-hun; Kim, Dong Geun, International Conference on Planarization Technology, ICPT 2022, ICPT, 2022-10-28

3
Mechanical Abrasion by Bi-Layered Pad Micro-Asperity in Chemical Mechanical Polishing

Ryu, Hyun Jun; Kim, Dong Geun; Kang, Sukkyung; Jeong, Ji-hun; Kim, Sanha, CIRP Annals 2021, CIRP, 2021-08-25

4
Superhydrophobicity of elastocapillary engineered re-entrant CNT topography for self-enrichment assisted femto-molar molecular sensing

Kim, Seong Jae; Jeong, Ji-hun; Ryu, Hyun Jun; Yang, Inyeong; Kim, Dong Geun; Son, Jihyuk; Kim, Sanha, The 19th International Nanotech Symposium & Exhibition (Nanokorea 2021), Korea Nanotechnology Research Society., 2021-07-07

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