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Showing results 1 to 6 of 6

1
A comparative study of fatigue behavior of SnAgCu and SnPb solder joints

Lee, Soon-Bok; Kim, Ilho; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004

2
Cyclic Loading Behavior of Solder Joints in Electronic Packaging

Park, Tae-Sang; Lee, Soon-Bok, KSME 2003 Spring Conference, 2003

3
Cyclic Stress-Strain Measurement Tests of Sn3. 5Ag0.75C u Solder Joint

Lee, Soon-Bok; Park, Tae-Sang, The International Symposium on Electronic Materials and Packaging 2002, pp.317 - 323, 2002

4
Fatigue Strength Evaluation of Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints under Mixed Mode Loading Cases

Park, Tae-Sang; Lee, Soon-Bok, KSME 2002 Conferece of Materials and Fracture Division, KSME 02MF026, pp.164 - 170, 2002

5
Mechanical Fatigue Tests of Solder Joints under Mixed-Mode Loading Cases

Park, Tae-Sang; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.438 - 443, 2001

6
Mechanical Properties of Thin Film for MEMS Application

Lee, Soon-Bok; Baek, Dong-Cheon; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004

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