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Showing results 1 to 9 of 9

1
A study on the measurement of mechanical properties for nickel thin film

Park, TS; Baek, DC; Lee, Soon-Bok, The Autumn Conference of KSME 2002, 2002

2
Computational Mechanics Aided Reliability Assessment of Interconnections in Advanced Electronics Packaging

Lee, Soon-Bok; Park, TS; Ham, SJ, WCCM VI, 2004

3
Experimental Approaches for Solder Joint Relaibility

Lee, Soon-Bok; Ham, SJ; Park, TS, SEMICON Korea Technical Sysmposium 2002, pp.79 - 85, 2002-01-01

4
Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging

Lee, Soon-Bok; Park, TS; Ham, SJ, International Conference on Advanced Technology in Experimental Mechanics, ATEM'99, pp.661 - 666, 1999

5
Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases

Park, TS; Lee, Soon-Bok, 52nd Electronic Components and Technology Conference, pp.979 - 984, 2002-05-28

6
Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints

Lee, Soon-Bok; Park, TS, TMA Conference, 2003

7
Measurement of Mechanical Properties of Electroplated Nickel Thin Film for MEMS Application

Back, DC; Park, TS; Lee, Soon-Bok; Lee, NK; Choi, TH; Na, KH, KSME 2003 Spring Conference, 2003

8
The Measurement of Mechanical Properties for Nickel Thin Film

Park, TS; Baek, DC; Lee, Soon-Bok; Na, KH, Workshop on Development of Micro Optical and Thermofluidic Devices with Functionality, pp.73 - 78, 2002

9
Thermal loading measurement and thermal fatigue test for solder bumps in electronncs packaging

Park, TS; Lee, Soon-Bok, KSME 99 Conference of Materials and Fracture Division, KSME 99MF27, pp.55 - 60, 1999

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