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An Evaluation of Thermal Deformation Behavior in Electronic Package Using UV Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, Tokyo Tech-KAIST joint workshop, pp.34 - 35, 2005 |
An evaluation of thermal deformation behavior in electronics package using UV moire interferometry Lee, Soon-Bok; Park, Jin-Hyung, 2005 KSME Spring Conference, pp.10 - 10, 2005 |
Health monitoring method for electronic package using a simple Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, ATEM'07 and ACEM6, 2007 |
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