Browse "ME-Conference Papers(학술회의논문)" by Author Park, Chun Myung
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| Measurement of Equivalent Modulus of Chip Package Using Bending Test Kim, Hyeongjun; Lee, Tae-Ik; Park, Chun Myung; Park, Chang Kyu; Kim, Taek-Soo, The 17th International Symposium on Microelectronics and Packaging (ISMP2018), The Korean Microelectronics and Packaging Society, 2018-10-25 |
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