Browse "ME-Conference Papers(학술회의논문)" by Author Paik, Kyoung-Wook

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Chip warpage damage model for ACA/NCA film type electronic packages

Lee, Soon-Bok; Yang, Se Young; Kwon, Woon-Seong; Paik, Kyoung-Wook, APCFS(Asian Pacific Conf for Fracture and Strength)'04, pp.103 - 103, 2004

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