Browse "ME-Conference Papers(학술회의논문)" by Author Oh, Seung Jin

Showing results 1 to 5 of 5

1
Adhesive bonding characteristics of the fire retardant sandwich constructions

Oh, Seung Jin; Kim, Min Kook; Lee, DY; Choe, Jae Heon; Nam, Soo Hyun; Lee, Dai Gil, Adhances in Mechanics of Composite Materials and Structures, Composite seoul 2015, 2015-10-23

2
Elucidating the Mechanical Properties of Transparent Conductive Thin Films for Mechanically Reliable Microelectronics

Oh, Seung Jin; Choi, Kyung Cheol; Kwon, Jeong Hyun; Kim, Taek-Soo, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27

3
Elucidating Thickness-Dependent Plane Stress Fracture Toughness of Ultra-Thin Nanocrystalline Gold Films

Song, Myoung; Ma, Boo Soo; Oh, Seung Jin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06

4
Enhancing Mechanical Reliability in Thin Film Encapsulation Using Low-Temperature Atomic Layer Deposition

Oh, Seung Jin; Lee, Sun-Woo; Ham, Yeong Seok; Kwon, Jeong Hyun; Kim, Taek-Soo, The 14th International Symposium on NDT in Aerospace (AeroNDT2023), The Korean Society of Mechanical Engineers, 2023-11-08

5
Mechanical Behavior of Transparent Conducting Oxide Thin Films for Advanced Electronic Applications

Oh, Seung Jin; Kwon, Jeong Hyun; Lee, Sangmin; Kim, Taek-Soo, ICEM20 - 20th International Conference on Experimental Mechanics, EuraSEM - European Society of Experimental Mechanics, 2023-07-06

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