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Showing results 1 to 2 of 2

1
Die Shear test of the coined solder bumps package with various UBM and solder materials

Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003

2
Numerical Simulation of the Formation of Coined Solder Bump

Hwang, T.K; Lee, Soon-Bok; Nah, JW; Paik, KW, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.388 - 392, 2001

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