Showing results 1 to 1 of 1
Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface Treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jun Soo; Lee, Jihyun; et al, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
Discover