Browse "ME-Conference Papers(학술회의논문)" by Author Lee, Juhyeon

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Development of a numerical simulation model for predicting the temperature of a flip-chip package during the laser-Assisted bonding (LAB) process

Lee, Juhyeon; Kim, Sung Jin; Kim, Boseung, 21st InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2022, IEEE Computer Society, 2022-05

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