Browse "ME-Conference Papers(학술회의논문)" by Author Kwom, WS

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1
Analytical Approach to Evaluate Shear Stress in flip Chip Interconnection using NCA/ACF

Lee, Soon-Bok; Paik, Kyung-Wook; Kwom, WS; Yang, SY, 5th International Symposium on Electronic Materials and Packagings 2003, pp.204 - 209, 2002

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