Showing results 1 to 2 of 2
An automatic inspection of SMT rectangular chips based on PCA algorithm Koh K.C.; Ko K.W.; Choi B.-W.; Kim J.H.; Cho, Hyungsuck, Machine Vision and its Optomechatronic Applications, v.5603, pp.208 - 214, 2004-10-26 |
Inspection of ball grid array (BGA) solder joints using X-ray cross-sectional images Roh Y.J.; Ko K.W.; Cho, Hyungsuck; Kim H.C.; Joo H.N.; Kim S.K., Proceedings of the 1999 Machine Vision Systems for Inspection and Metrology VIII, v.3836, pp.168 - 178, International Society for Optical Engineering (SPIE), 1999-09-21 |
Discover