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Showing results 1 to 2 of 2

1
Joining Technology and Joint Reliability between Flexible Substrate and Si Chip with Micro-bump

Ko, Yong Ho; Kim, Taek-Soo; Bang, Jung-Hwan; Lee, Chang-Woo, 67th IIW International Conference, IIW, 2014-07-17

2
무연솔더와 Cu 기판 계면에서 계면 반응과 금속간화합물 성장에 그래핀 전사가 미치는 영향

Ko, Yong Ho; Choi, KG; Yoon, Taeshik; Lee, CW; Kim, Taek Soo, 2016 대한용접접합학회 춘계 학술발표대회, 대한용접접합학회, 2016-04-21

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