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Investigation on the Mechanical Reliability of TiN/SiO2 for W Nucleation Processes

Lee, Sun Woo; Kim, Dong Jun; Jeon, Jinho; Yun, WonJun; Kim, Tae-Sung; Kim, Taek-Soo, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05

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