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Showing results 1 to 4 of 4

1
Investigation of Copper-Ruthenium Diffusion Behavior in Ruthenium Passivated Copper Direct Bonding

Kim, Myeongeun; Kang, Sukkyung; Kim, Sanha; Kim, Kyung Min, The 7th International Conference on Advanced Electromaterials, ICAE 2023, International Conference on Advanced Electromaterials(ICAE), 2023-11-02

2
Plasma-Assisted CMP for Planarization of Adhesive Polymers in 3D Stacked Semiconductor Devices

Kang, Sukkyung; Park, Juseong; Jeon, Chan Su; Kim, Kyung Min; Kim, Sanha, International Conference on Planarization/CMP Technology, ICPT 2023, International Conference on Planarization Technology (ICPT), 2023-11-01

3
Polymer/Cu hybrid CMP process for high-reliability of Cu direct bonding

Park, Juseong; Kim, Sanha; Kang Sukkyung; Kim, Kyung Min, Electronic Materials and Nanotechnology for Green Environment (ENGE) 2022, The Korean Institute of Metals and Materials, 2022-11-06

4
Self-pressure regulating CMP process for hybrid Cu/polymer bonding

Kang, Sukkyung; Park, Juseong; Kim, Kyung Min; Kim, Sanha, 3rd Korea-Tribology International Symposium, K-TRIB2023, Korean Tribology Society, 2023-04-05

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