Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Joong Jung
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| Optimization of Cu Interconnects - SiCN Interfacial Adhesion by Surface Treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jun Soo; Lee, Jihyun; et al, The 19th International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2021-11-05 |
| Optimization of Cu interconnects - SiCN interfacial adhesion by surface treatments Kim, Dong Jun; Kang, Sumin; Lee, Sun Woo; Lee, Inhwa; Park, Seungju; Lee, Jihyun; Kim, Joong Jung; et al, 73rd IEEE Electronic Components and Technology Conference, ECTC 2023, pp.363 - 373, IEEE, 2023-05-31 |
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