DSpace at KOASAS
Browsing DSpace

Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Jihye

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 3 of 3

1
Effects of ACFs Modulus and Adhesion Strength on the Bending Reliability of CIF(Chip-in-Flex) Packages at Humid Environment

Kim, Jihye; Lee, Tae-Ik; Kim, Taek-Soo; Paik, Kyung-Wook, 68th IEEE Electronic Components and Technology Conference (ECTC), pp.2319 - 2325, IEEE-CPMT, 2018-05-31

2
Effects of Anisotropic Conductive Films (ACFs) Gap Heights on the Bending Reliability of Chip-in-Flex (CIF) Packages for Wearable Electronics Applications

Kim, Jihye; Lee, Tae-Ik; Yoon, Dal Jin; Kim, Taek-Soo; Paik, Kyung-Wook, IEEE 67th Electronic Components and Technology Conference (ECTC), pp.2161 - 2167, IEEE-CPMT, 2017-06-01

3
Experimental Verification of Through-Thickness Strain Distribution in Flexible Devices Under Bending

Lee, Tae-Ik; Kim, Wansun; Jo, Woosung; Kim, Jihye; Paik, Kyung-Wook; Kim, Taek-Soo, 18th International Conference on Experimental Mechanics, European society for experimental mechanics, 2018-07-01

Discover

rss_1.0 rss_2.0 atom_1.0