Showing results 1 to 3 of 3
An Advanced Thermal Cycling Test for Reliability Assessment of a Stack Package Lee, Soon-Bok; Jang, Jae-Won, EMAP2011, 2011-12 |
Thermally Induced Deformation Measurement of Through-Silicon Via (TSV) Structures using an Atomic Force Microscope (AFM) Moiré Method Jang, Jae-Won; Lee, Soon-Bok, IEEE Nano 2012, IEEE, 2012-08-20 |
Warpage behavior of chip-on-flex(COF) package under thermal cycling condition Jang, Jae-Won; Suk, Kyoung-Lim; Paik, Kyung-Wook; Lee, Soon-Bok, Int conf. on Computer-aided Manufacturing and Design, CMD2010, 2010-11 |
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