Browse "ME-Conference Papers(학술회의논문)" by Author Jang, JW
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| Fracture toughness assessment of ACF flip-chip packages under high moisture condition with Moire interferometry Park, JH; Jang, JW; Jang, KW; Paik, KW; Lee, Soon-Bok, 2009 European Microelectronics and Packaging Conference, EMPC 2009, EMPC, 2009-06-15 |
| Reliability evaluation of CIF (chip-in-flex) and COF (chip-on-flex) packages Jang, JW; Suk, KL; Paik, KW; Lee, Soon-Bok, 4th International Conference on Experimental Mechanics, pp.119 -, 2009-11-18 |
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