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Browse "ME-Conference Papers(학술회의논문)" by Author Hwang, Tae-Kyung

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Showing results 1 to 4 of 4

1	Effects of cooling rates on material behaviors of solder alloys Lee, Soon-Bok; Hwang, Tae-Kyung, IMAPS-Korea 추계 기술 심포지움, pp.24 - 24, 2004
2	Material Characterization of Lead-Free Solder Materials Lee, Soon-Bok; Hwang, Tae-Kyung, KAIST-Tokyo Tech Joint Workshop, 2004
3	Mechanicsl behavior of lead-free solder materials with various microstructures Lee, Soon-Bok; Hwang, Tae-Kyung, Tokyo Tech-KAIST joint workshop, pp.24 - 25, 2005
4	Numerical Analysis of Coined Eutectic Solder Bumps Hwang, Tae-Kyung; Nah, Jae-Woong; Paik, Kyung-Wook; Lee, Soon-Bok, KSME 2002 Conference of Materials and Fracture Division, KSME 02MF025, pp.158 - 163, 2002

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