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Showing results 1 to 5 of 5

1
A study on the thermal deformation of ACF assemblies using Moiré interferometry and FEM

Hwang, TK; Ham, SJ; Lee, Soon-Bok, Int. Symposium on Electronic Materials and Packaging, pp.358 - 363, Int. Symposium on Electronic Materials and Packaging, 2000-11

2
Die Shear test of the coined solder bumps package with various UBM and solder materials

Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003

3
Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry

Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001

4
Nemerical Analysis of Coined Eutectic Solder Bumps

Lee, Soon-Bok; Hwang, TK; NAH, JW; Paik, KW, KSME 2002 Conference of Materials and Fracture Division,KSME 02MF025, pp.158 - 163, 2002

5
The Influence of Microstructure Change on Thermal Fatigue Life of Solder Ball

Lee, Soon-Bok; Ryu, Jong-Eun; Hwang, TK, Tokyo Tech-KAIST joint workshop, pp.52 - 53, 2005

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