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Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability

Lee, Soon-Bok; Bae, J.S.; Shin, J.W.; Paik, K.W., International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics 2014, 2014-11-17

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