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Showing results 131 to 134 of 134

131
Visualization and Healing of Graphene Defects

Yoon , T.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15

132
Wapage Analysis of Flexible Electronics

Kim, Taek-Soo, International Conference on Electronics Packaging, The Japan Institute of Electronics Packaging, 2019-04-19

133
Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate

Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14

134
Wide Range-Sensitive, Bending-Insensitive Pressure Detection and Application to Wearable Healthcare Device

Kim, Seunghwan; Amjadi, Morteza; Lee, Tae-Ik; Jeong, Yongrok; Kwon, Donguk; Kim, Min Seong; Kim, Kyuyoung; et al, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, pp.374 - 377, Institute of Electrical and Electronics Engineers Inc., 2019-06

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