Showing results 128 to 134 of 134
Ultra-flexible high performance silicon nano-membrane transistor for wearable electronics KIM, SEUNGYOON; Bong, Jae Hoon; Kim, Cheolgyu; Kim, Taek-Soo; Hwang, Wan Sik; Cho, Byung-Jin, The 10th International Conference on Advanced Materials and Devices, Applied Physics Division, The Korean Physical Society, 2017-12-06 |
Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15 |
Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, J.-H; LEE, TAE-IK; Shin, J.-W; Kim, Taek-Soo; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
Visualization and Healing of Graphene Defects Yoon , T.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15 |
Wapage Analysis of Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging, The Japan Institute of Electronics Packaging, 2019-04-19 |
Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
Wide Range-Sensitive, Bending-Insensitive Pressure Detection and Application to Wearable Healthcare Device Kim, Seunghwan; Amjadi, Morteza; Lee, Tae-Ik; Jeong, Yongrok; Kwon, Donguk; Kim, Min Seong; Kim, Kyuyoung; et al, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, pp.374 - 377, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
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