Browse "ME-Conference Papers(학술회의논문)" by Author Kim, Taek-Soo
Showing results 121 to 134 of 134
| Tensile Properties of ALD Alumina without Substrate Measured by Tensile Testing on Water Surface Lee, Sangmin; Koo, Junmo; Kim, Junmo; Shim, Joon-Hyung; Kim, Taek-Soo, 2019 MRS Fall Meeting & Exhibit, Materials Research Society, 2019-12-02 |
| Tensile Testing of Ultra-Thin Films using Water Surface Kim, J; Nizami, A; Hwangbo, Y; Jang, B; Lee, H; Woo, C; Hyun, S; et al, 2013 KSPE Fall Meeting, KSPE, 2013-10-30 |
| Thermal Assisted UV-Ozone Treatment to Improve Reliability of Ag Nanoparticle Thin Films Lee, I.; Lee, J.; Ko, Seung Hwan; Kim, Taek-Soo, 15th International Conference on Electronic Materials and Packaging, Electronic Materials and Packaging (EMAP), 2013-10-06 |
| Thermo-Mechanical Behavior of Molded Underfill Filling the Sub-100μm Die Gap for Advanced Packaging Ju, Min Sang; Kim, Junmo; Gu, Chang-Yeon; Song, Myoung; Ma, Sung Woo; Lee, Jin Hee; Lee, Woong-Sun; et al, The 21st International Symposium on Microelectronics and Packaging (ISMP), The Korean Microelectronics and Packaging Society, 2023-10-27 |
| Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26 |
| Tuning Depth Profiles of Low-k Dielectrics with UV Curing Kim, Taek-Soo; Tsuji, N; van der Hilst, J; Matsushita, K; Kobayashi, N; Chumakov, D; Geisler, H; et al, Advanced Metallization Conference, Advanced Metallization Conference, 2008-01-01 |
| Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14 |
| Ultra-flexible high performance silicon nano-membrane transistor for wearable electronics KIM, SEUNGYOON; Bong, Jae Hoon; Kim, Cheolgyu; Kim, Taek-Soo; Hwang, Wan Sik; Cho, Byung-Jin, The 10th International Conference on Advanced Materials and Devices, Applied Physics Division, The Korean Physical Society, 2017-12-06 |
| Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, Ji Hye; Lee, Tae-Ik; Shin, Ji Won; Kim, Taek-Soo; Paik, Kyung Wook, The 14th International Symposium on Microelectronics and Packaging, The Korean Microelectronics and Packaging Society, 2015-10-15 |
| Ultra-Thin Chip-in-Flex (CIF) technology using Anisotropic Conductive Films (ACFs) for Wearable Electronics Applications Kim, J.-H; LEE, TAE-IK; Shin, J.-W; Kim, Taek-Soo; Paik, Kyung-Wook, 65th Electronic Components and Technology Conference, IEEE Electronic Components and Technology Conference, 2015-05-28 |
| Visualization and Healing of Graphene Defects Yoon , T.; Kim, Taek-Soo, CARBON 2015, CARBON, 2015-07-15 |
| Wapage Analysis of Flexible Electronics Kim, Taek-Soo, International Conference on Electronics Packaging, The Japan Institute of Electronics Packaging, 2019-04-19 |
| Warpage analysis of electroplated Cu and solder resist films on polymer based packaging substrate Kim, CG; Lee, T; Kim, MS; Kim, Taek-Soo, International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics, 2014-11-14 |
| Wide Range-Sensitive, Bending-Insensitive Pressure Detection and Application to Wearable Healthcare Device Kim, Seunghwan; Amjadi, Morteza; Lee, Tae-Ik; Jeong, Yongrok; Kwon, Donguk; Kim, Min Seong; Kim, Kyuyoung; et al, 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, pp.374 - 377, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
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