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Showing results 18 to 21 of 21

18
Tensile Testing of Submicron Thick Free-standing Metal Thin Films without Etching Process

Seo, Jeong Min; Jo, Woo Sung; Lee, Sang Min; Kim, Taek Soo, The 3rd International Conference on Materials and Reliability, ICMR, 2015-11-25

19
The Effect of Anisotropic Conductive Films Adhesion on the Bending Reliability of Chip-in-Flex Packages for Wearable Electronics Applications

Kim, Ji Hye; Lee, Tae Ik; Kim, Taek Soo; Paik, Kyung Wook, 66th Electronic Components and Technology Conference, pp.1583 - 1591, Electronic Components and Technology Conference, 2016-06-01

20
무연솔더와 Cu 기판 계면에서 계면 반응과 금속간화합물 성장에 그래핀 전사가 미치는 영향

Ko, Yong Ho; Choi, KG; Yoon, Taeshik; Lee, CW; Kim, Taek Soo, 2016 대한용접접합학회 춘계 학술발표대회, 대한용접접합학회, 2016-04-21

21
플렉시블 디바이스를 위한 첨단박막의 기계적 신뢰성

Kim, Taek Soo, 제29회 첨단구조재료 심포지엄, 대한금속 재료학회, 2015-11-27

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