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Browse "ME-Conference Papers(학술회의논문)" by Author R.H. Dauskardt

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Showing results 9 to 11 of 11

9
Thermomechanical Reliability for Emerging Device Technologies: Implications for ULK Integration, 3-D Structures and Packaging

Kim, Taek-Soo; R.H. Dauskardt, 2009 IEEE International Reliability Physics Symposium, IEEE, 2009-04-26

10
Tuning Depth Profiles of Low-k Dielectrics with UV Curing

Kim, Taek-Soo; Tsuji, N; van der Hilst, J; Matsushita, K; Kobayashi, N; Chumakov, D; Geisler, H; et al, Advanced Metallization Conference, Advanced Metallization Conference, 2008-01-01

11
Tuning UV Curing Depth Profiles for Optimal Mechanical Properties of Low-k Films

Kim, Taek-Soo; Chumakov, D; Zschech, E; R.H. Dauskardt, Materials Research Society 2009 Spring Meeting, Materials Research Society, 2009-04-14

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