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7
Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

Son, HY; Paik, KW; Kim, I; Park, JH; Lee, Soon-Bok; Jung, GJ; Park, BJ; et al, 10th Electronics Packaging Technology Conference, EPTC 2008, pp.716 - 724, 2008-12-09

8
Thermal Cycling Reliability Issue of Thick Cu Column Based Cu/SnAg Double-Bump Flip Chip Assemblies on Organic Substrates for Fine Pitch Applications

Lee, Soon-Bok; Son, HY; Kim, I; Park, JH; Jung, GJ; Park, BJ; Byun, KY; et al, EPTC 2008, 2008

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