Browse "ME-Conference Papers(학술회의논문)" by Author Song J.-Y.

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Pre-bonding method using self-alignment effect for multichip packaging

Lee J.H.; Ha T.H.; Lee C.W.; Song J.-Y.; Cha M.S.; Yoo C.D., 2009 IEEE International Symposium on Assembly and Manufacturing, ISAM 2009, pp.118 - 123, 2009-11-17

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